| NO. | Item | Production Capacity |
| 1 | Layer Counts | 1----50 |
| 2 | Material Type | FR4,High TG , CEM1,CEM3,PTFE,Aluminum Base,Arlon,Rogers,Halogen free |
| 3 | Maximum Panel Size | 500mmx1200mm |
| 4 | Board Outline Tolerance | Routing:±0.13mm ;Punching:±0.05mm |
| 5 | Finished Board Thickness | 0.20mm--6.00mm |
| 6 | Finshed Board Thickness Tolerance | >=0.8mm : ±8% ; <0.8mm: ±10% |
| 7 | Minimum Trace Width/Space | 0.003" /0.003" |
| 8 | Finished Outer Copper Thickness | 1OZ---5OZ |
| 9 | Finshed Inner Cooper Thickness | 0.50OZ--5OZ |
| 10 | Finished Hole Size | 0.10mm--6.30mm |
| 11 | Hole Size Tolerance | NPTH: ±0.05mm ; PTH: ±0.076mm |
| 12 | Hole Location Registration（Mechanical） | ±0.08mm |
| 13 | Aspect Ratio | 13:01 |
| 14 | Solder Mask Type | LPI |
| 15 | SMT Mini.Solder Mask Width | 0.08mm |
| 16 | Plug Via Diameter | 0.25mm--0.60mm |
| 17 | Impedance Control Tolerance | ±5% |
| 18 | Surface Treatment Type | HASL;HASL+Lead Free;Immersion Gold;Immersion Tin;Flash Gold; |
|
| OSP;Immersion Silver;Gold Finger；Carbon Ink；Peelable Mask |
