| NO. | Item | Production Capacity |
| 1 | Layer Counts | 1--6 |
| 2 | Panel Size | Maximum | 400mm×650mm |
| 3 | Base Material Type | Polyimide (PI) Thickness(µm) | 12.5, 25, 50, 75, 125 |
| Polyester(PET) Thickness(µm) | 25, 50, 75, 100, 125 |
| 4 | Base Copper Thickness | ED &RA (Rolled Annealed)(μm) | 18, 35, 70 |
| 5 | Coverlay Thickness | Polyimide (PI) (μm) | 12.5, 25, 50, 75, 125 |
| Polyester (PET) (μm) | 25, 50 |
| 6 | Adhesive Thickness | 12.5, 25, 50 um |
| 7 | Stiffener Type | Polyimide (PI);Polyester (PET);FR-4 ;Aluminium foil |
| 8 | Minimum Hole Size | 0.2mm |
| 9 | Minimum Slot hole | 0.6mm×0.8mm |
| 10 | Minimum Trace Width/Space | 0.05mm/0.05mm |
| 11 | Minimum Annular Ring Width | 0.05 |
| 12 | Minimum Outline Tolerance | ±0.05mm |
| 13 | Minimum SMT Pitch | 0.40mm |
| 14 | Insulation Resistance | 1011Ω |
| 15 | Peel off Shock Resistance | 1.0N/mm |
| 16 | Thermal shock Resistance | 260℃ 10sec 3times |
| 17 | Surface Treatment Type | HASL;HASL+Lead Free；Immersion Gold；Immersion Tin； |
| Flash Gold;OSP;Immersion Silver;Gold Finger |
| 18 | E-test | Volatage:24V--300V;Continuity:5--100MΩ;Flying Probe Tester ;AOI |
