| PCB Assembly Capability |
| Order Quantity | 1-50,000pcs(including prototype) |
| Components | SMD and THT
From size 0402.0201 to 01005
SOIC,PLCC,TSOP,QFP,BGA |
| Assembly Method | Single and double-sided/SMD and THT/SMT and Thru-hole |
| Ball Grid Array(BGA) | As small as 0.5mm pitch
All BGA placements are inspected by X-Ray |
| Components Package | Poles,Reels,Tape Strips,Bulk Supply |
| Maximum Componentsize | 55*55*15mm
Fine Pitch from 0.4mm
Minimum Pin width 0.2mm |
| Solder | Lead free and conforming to DIN 32513,ISO,EN29454,IPC 650 |
| Related Test | Aol & X-Ray Inspection,Flying Probe Test and in Circuit Test |
| File format | BOM & Gerber files |
